Abstract: This paper presents a combined bending-torsional deformation device that can simultaneously measure the Young's modulus and the shear modulus of the material under one load. This device overcomes two separate sets of device for the measurement. In the device proposed in this article，a large deformation ( about 10 mm) can be generated by a small force ( about 1 N) ，which allows us to use displacement sensors to measure the deformation instead of an optical lever. As a result，the entire device is significantly smaller than the traditional tensile method for measuring the Young's modulus device，which has better use value and promotion value.

Key words: Young's modulus, shear modulus, combined deformation method